Solder reflow furnace

Details Solder reflow furnace Solder reflow furnace

1991-06-05

1992-10-13

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

228 43, 219388, 219478, B23K 1012

Patent

active

051543389

ABSTRACT:
A reflow furnace has a tunnel through which a conveyor for printed circuit boards passes. A plurality of pairs of panel-type blowers capable of blowing hot gas are disposed in the tunnel. The two panel-type blowers in each pair are disposed opposite one another above and below the conveyor. Each panel-type blower has an inlet and a discharge port. The discharge ports of opposing panel-type blowers partially overlap one another in the longitudinal direction of the furnace. When a printed circuit board is present between a pair of panel-type blowers, gas discharged from the discharge ports simultaneously heats both sides of the printed circuit board.

REFERENCES:
patent: 5039841 (1991-08-01), Kato et al.
patent: 5066850 (1991-11-01), Kondo
patent: 5069380 (1991-12-01), Deambrosio

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