Solder reflow apparatus

Drying and gas or vapor contact with solids – Apparatus – With means to treat gas or vapor

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Details

34 79, F26B 2106

Patent

active

049514016

ABSTRACT:
A reflow apparatus for soldering has a tunnel and a pipe which form an endless passageway for hot gas. Infrared panel heaters are disposed inside the tunnel for heating printed circuit boards which travel through the tunnel on a conveyor. Hot gas is made to circulate through the passageway by a flow-producing device. A filter is disposed in the passageway for removing particles from fumes which are formed during soldering.

REFERENCES:
patent: 4238122 (1980-12-01), Snyder et al.
patent: 4321031 (1982-03-01), Woodgate
patent: 4771929 (1988-09-01), Bahr et al.

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