Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2006-02-28
2006-02-28
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S245000, C228S256000, C257S772000, C257S780000, C438S612000
Reexamination Certificate
active
07004376
ABSTRACT:
There is provided a mask for use in printing solder on a plurality of terminals formed on a substrate so as to correspond to a plurality of terminals of an IC package. The mask has openings through which the solder is applied, and the openings are larger than the terminals. Although a wiring line adjacent to the terminals may be covered with the solder, a reflow process causes the solder to be divided into a first portion and a second portion, thus preventing short-circuits between the wiring line and the terminals.
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Communication from Chinese Patent Office regarding counterpart application.
Communication from Korean Patent Office re: related application.
Edmondson Lynne R.
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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