Solder preform stabilization for lead frames

Details Solder preform stabilization for lead frames Solder preform stabilization for lead frames

1983-06-17

1985-03-12

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

Carbonizing to form article

Agglomeration or accretion

26427215, 26427217, 264278, 264317, B29C 604

Patent

active

045044279

ABSTRACT:
Fabricating spacer bars or dam bars in conventional lead frames of a low melting material, e.g. solder, permits facile removal of the bar after molding. The low melting bars can be removed by furnace heating, localized radiant energy heating, exposure to rapid thermal annealing (RTA), hot air or hot liquid leveling, etc.

REFERENCES:
patent: 1219629 (1917-03-01), Davenport
patent: 3076051 (1963-01-01), Haba
patent: 3418089 (1968-12-01), Berg
patent: 3429030 (1969-02-01), Bell
patent: 3494023 (1970-02-01), Dorendorf
patent: 3529054 (1970-09-01), Hepner
patent: 3810300 (1974-05-01), Hulmes et al.
patent: 4137546 (1979-01-01), Frusco
Electronic Packaging and Production, "Solder Coating and Leveling Competes with Tin-Lead Electroplate", H. W. Markstein, Dec. 1982, pp. 30-35.

Affiliated with

Also associated with

Rating

Solder preform stabilization for lead frames does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder preform stabilization for lead frames, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder preform stabilization for lead frames will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-707234