Solder preform and methods employing the same

Details Solder preform and methods employing the same Solder preform and methods employing the same

1985-11-27

1987-12-01

Jordan, M.

Metal fusion bonding

Process

Preplacing solid filler

228 563, B23K 3512

Patent

active

047098490

ABSTRACT:
A solder preform comprises a body of solder material having at least three legs extending outwardly from a generally central base portion. In a method of use, the preform is disposed between two solderable surfaces (such as the metalized undersurface of a semiconductor die and a support surface therefor), heated above the solder melting point to cause the solder to flow between the surfaces, and then cooled to solidify the solder and effect the bond. The preform configuration is such that the melting solder flows generally outward from the central base portion to expel gases from between the surfaces to be bonded.

REFERENCES:
patent: 2445858 (1948-07-01), Mitchell et al.
patent: 3340602 (1967-09-01), Hontz
patent: 3555669 (1971-01-01), Tarn
patent: 3786566 (1974-01-01), Weston
patent: 4020987 (1977-05-01), Hascoe
A Guide to Preform Soldering, 2/9/60, p. 2.
Taraseiskey, H., "Custom Power Hybrids," Solid State Technology, Oct. 1985, pp. 111-117.

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