Solder precoating method

Details Solder precoating method Solder precoating method

2007-01-29

2009-08-04

Kopec, Mark (Department: 1796)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C252S071000, C252S500000, C075S255000, C148S022000, C148S023000, C148S024000, C148S025000, C228S056300, C228S180220, C428S042100, C438S200000

Reexamination Certificate

active

07569164

ABSTRACT:
A solder paste composition used in a solder precoating method of forming solder bumps by forming a dam around electrodes on a substrate, filling a solder paste composition on the electrodes within opening parts surrounded by the dam, and heating the solder paste composition filled, so that solder is adhered to the surfaces of the electrodes. The solder paste composition contains solder powder, which is of a particle size distribution in which particles having a particle size of below 10 μm are present 16% or more, and a sum of the particles having a particle size of below 10 μm and particles having a particle size of 10 μm or more and below 20 μm is 90% or more. This enables to suppress occurrence of bump defects, and form solder bumps of a uniform height with a high yield by a solder precoating method using the dam.

REFERENCES:
patent: 5162257 (1992-11-01), Yung
patent: 5294242 (1994-03-01), Zurecki et al.
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 5385290 (1995-01-01), Degani
patent: 5431745 (1995-07-01), Koschlig et al.
patent: 6193143 (2001-02-01), Ishikawa
patent: 6519842 (2003-02-01), Fukunaga et al.
patent: 6881278 (2005-04-01), Amita et al.
patent: 6884278 (2005-04-01), Shimizu et al.
patent: 6923875 (2005-08-01), Ikeda et al.
patent: 2002/0046627 (2002-04-01), Amita et al.
patent: 2002/0064933 (2002-05-01), Ueoka
patent: 2003/0085253 (2003-05-01), Shimizu et al.
patent: 2003/0157761 (2003-08-01), Sakuyama
patent: 2003/0200836 (2003-10-01), Amita et al.
patent: 2004/0217152 (2004-11-01), Taguchi
patent: 2005/0217757 (2005-10-01), Miyano
patent: 2006/0071051 (2006-04-01), Shoji et al.
patent: 2007/0044295 (2007-03-01), Chen
patent: 2007/0131912 (2007-06-01), Simone et al.
patent: 2007/0167307 (2007-07-01), Brodie
patent: 2007/0181218 (2007-08-01), Sakamoto et al.
patent: 2007/0218238 (2007-09-01), Greer
patent: 2008/0023665 (2008-01-01), Weiser et al.
patent: 1 038 628 (2000-09-01), None
patent: 1 342 726 (2003-09-01), None
patent: 62-014433 (1987-01-01), None
patent: 01-157796 (1989-06-01), None
patent: 02-310991 (1990-12-01), None
patent: 6-125169 (1994-05-01), None
patent: 6-142975 (1994-05-01), None
patent: 07-155985 (1995-06-01), None
patent: 07 326853 (1995-12-01), None
patent: 2002-141367 (2002-05-01), None
patent: 2002-192380 (2002-07-01), None
patent: 2002-334895 (2002-11-01), None
patent: 2002-361475 (2002-12-01), None
patent: 2003-251494 (2003-09-01), None
patent: 2005-298921 (2005-10-01), None
patent: WO 99/64199 (1999-12-01), None
patent: WO 01/72466 (2001-10-01), None
U.S. Appl. No. 09/646,308, filed Sep. 14, 2001.

Affiliated with

Also associated with

Rating

Solder precoating method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder precoating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder precoating method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4059718