Solder precipitating composition

Details Solder precipitating composition Solder precipitating composition

2005-08-02

2005-08-02

Andrews, Melvyn (Department: 1742)

Metal treatment

Compositions

Fluxing

C228S209000

Reexamination Certificate

active

06923875

ABSTRACT:
According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.

REFERENCES:
patent: 2950184 (1960-08-01), Johnson et al.
patent: 5021269 (1991-06-01), Kono et al.
patent: 5118029 (1992-06-01), Fuse et al.
patent: 5145532 (1992-09-01), Fukunaga et al.
patent: 5296649 (1994-03-01), Kosuga et al.
patent: 5453582 (1995-09-01), Amano et al.
patent: 5601228 (1997-02-01), Fukunaga et al.
patent: 6132646 (2000-10-01), Zhou et al.
patent: 03-081093 (1991-04-01), None
patent: 07/155985 (1995-06-01), None
patent: 09-141490 (1997-06-01), None
patent: 11-058065 (1999-03-01), None
patent: 11-254184 (1999-09-01), None
patent: WO 98/08362 (1998-02-01), None

Affiliated with

Also associated with

Rating

Solder precipitating composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder precipitating composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder precipitating composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3524020