Solder/polymer composite paste and method

Details Solder/polymer composite paste and method Solder/polymer composite paste and method

1990-03-30

1991-11-05

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Heavy metal compound containing

148 24, 252512, 252514, B23K 3534

Patent

active

050628968

ABSTRACT:
An improved solder/polymer fluxless composite paste interconnection material having a low reflow temperature to form electrical contacts having good bonding strength and low contact resistance. The present pastes comprise a major proportion of a meltable metal alloy powder filler, free of noble metals and preferably free of lead, a minor proportion of a solution of a temperature-stable thermoplastic polymer having a softening temperature above the melting temperature of the metal powder filler in a volatile solvent which evaporates during reflow, and a minor proportion of a fluxing agent having a boiling point lower than the reflow temperature of the composition and higher than the melting point of the eutectic alloy powder filler. An oxide-free, partially coalesced metal alloy connection is obtained, which is polymer strengthened and reworkable at a low reflow temperature, per se, or in the presence of polymer solvent.

REFERENCES:
patent: 4419279 (1963-12-01), Abrams
patent: 4496475 (1985-01-01), Abrams
patent: 4545926 (1985-10-01), Fouts, Jr. et al.
patent: 4557860 (1985-12-01), DiSalvo et al.
patent: 4574056 (1986-03-01), Kimura
patent: 4619715 (1986-10-01), Hwang

Affiliated with

Also associated with

Rating

Solder/polymer composite paste and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder/polymer composite paste and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder/polymer composite paste and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-496484