Chemistry: electrical and wave energy – Processes and products
Patent
1985-06-03
1986-05-20
Tufariello, T. M.
Chemistry: electrical and wave energy
Processes and products
204 321, C25D 502, C25D 534
Patent
active
045899622
ABSTRACT:
A method for solder plating metal leads in plastic semiconductor packages comprises cleaning the leads followed by electroplating tin or a tin/lead alloy onto the leads. The cleaning is effected with a non-corrosive solution which is either a carboxylic acid, a hydroxycarboxylic acid, or a combination of both. The electroplating solution is a sulfonic acid or citric acid based system, including suitable tin salts and/or lead salts. A sequestering agent may be used to inhibit the corrosive effect of the electroplating bath.
REFERENCES:
patent: 3427232 (1969-02-01), Natwick
patent: 4163700 (1979-08-01), Igarashi et al.
Tech Specs (LeaRonal) TechSpec No. 47400-TS Aug. 8, 1983, 8 pages.
Belane Jagdish
Mathew Ranjan
Sajja Vijay M.
National Semiconductor Corporation
Pollock Michael J.
Tufariello T. M.
Winters Paul J.
Woodward Gail W.
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