Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1991-08-05
1993-03-16
Tufariello, T. M.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205228, C25D 502, C25D 550
Patent
active
051941376
ABSTRACT:
A method for forming a solder-bumped terminal on a planar dielectric substrate utilizes a terminal of a particular configuration and comprises depositing onto the terminal a thin plate of solder alloy and reflowing the solder alloy to form a bump. The terminal configuration includes an enlarged terminal pad connected to a relatively narrow linear runner section. Preferably, the runner section width is between about 50 and 150 microns, whereas the pad width is between about 1.2 and 2.0 times the runner section width. The terminal is initially fabricated to include a metal layer adjacent the substrate formed, for example, of copper and a thin, outer plate composed of the solder alloy. The solder plate is deposited in a uniform thickness to both the terminal pad and the adjacent runner section. The terminal is then heated to melt the solder plate, whereupon the molten solder is drawn from the runner onto the enlarged pad to form a bump. In a preferred embodiment, a solder plate between about 10 and 25 microns is electrodeposited onto the terminal and reflowed to form a bump having a height between 60 and 80 microns.
REFERENCES:
patent: 3871014 (1975-03-01), King et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4787611 (1989-11-01), LoVasco et al.
Metal Finishing, Guidebook and Directory published by Metals and Plastics Publication, Inc., (1987), pp. 280, 282, 284.
Beckenbaugh William M.
Cholewczynski Ken
Moore Kevin D.
Stafford John W.
Fekete Douglas D.
Motorola Inc.
Tufariello T. M.
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