Metal fusion bonding – Metallic heat applicator – Adjustable or detachable head or tip
Patent
1990-09-24
1991-11-19
Seidel, Richard K.
Metal fusion bonding
Metallic heat applicator
Adjustable or detachable head or tip
228 53, 228 42, 228 41, 228 33, 228257, 228214, 228219, 222592, 219209, B23K 302
Patent
active
050659324
ABSTRACT:
A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.
REFERENCES:
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patent: 4805830 (1989-02-01), Kawaguchi
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Hayden Terry F.
Hicks Christopher A.
Ledermann Peter G.
Nguyne Alvin D.
Steinbach Stephen C.
Elpel Jeanne M.
Gunter Jr. Charles D.
International Business Machines - Corporation
Seidel Richard K.
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