Solder placement nozzle with inert cover gas and inert gas bleed

Metal fusion bonding – Metallic heat applicator – Adjustable or detachable head or tip

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Details

228 53, 228 42, 228 41, 228 33, 228257, 228214, 228219, 222592, 219209, B23K 302

Patent

active

050659324

ABSTRACT:
A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes a nozzle head which has an interior bore for receiving an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the inteiror bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad. A source of bleed gas is supplied to the interior of the assembly to protect the component parts and excluse oxygen from the interior of the assembly. A cover gas is also supplied to the solder site to reduce oxidation of the moltent solder and reduce the amount of flux required.

REFERENCES:
patent: 1760519 (1930-05-01), Palmer
patent: 1906225 (1933-05-01), Dupau
patent: 2194920 (1940-03-01), Vaughn et al.
patent: 2780712 (1957-02-01), Thomas
patent: 2891308 (1959-06-01), Lyons
patent: 3358897 (1967-12-01), Christensen
patent: 3524752 (1970-08-01), Fleming
patent: 3838240 (1974-09-01), Schelhorn
patent: 3917147 (1975-11-01), Vanyi
patent: 4805830 (1989-02-01), Kawaguchi
patent: 4976393 (1990-12-01), Nakajima et al.

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