Solder placement nozzle assembly

Details Solder placement nozzle assembly Solder placement nozzle assembly

1990-09-24

1991-08-27

Seidel, Richard K.

Metal fusion bonding

Metallic heat applicator

Adjustable or detachable head or tip

228 53, 228 41, 228 33, 228257, 219209, 222592, B23K 302

Patent

active

050427083

ABSTRACT:
A nozzle assembly is shown for depositing solder onto a series of conductive surfaces such as the mounting pads of a surface mount integrated circuit board. The nozzle assembly includes an upper nozzle mount and a removeable nozzle head which has an interior bore for receiving a portion of the nozzle mount and an elongate heat source. The nozzle head also includes an orifice for receiving solid solder fed within the interior bore to contact the elongate heat source. The interior bore terminates in a solder reservoir for molten solder which is fed within the interior bore to contact the elongate heat source. The molten solder is dispensed through a tip opening to deposit uniform amounts of solder on each pad.

REFERENCES:
patent: 1760519 (1930-05-01), Palmer
patent: 1906225 (1933-05-01), Dupau
patent: 2780712 (1957-02-01), Thomas
patent: 3358897 (1967-12-01), Christensen
patent: 4903884 (1990-02-01), Royston et al.
patent: 4932581 (1990-06-01), Ohle et al.

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