Solder placement apparatus and method

Cutting – Tool engages work during dwell of intermittent workfeed – Work-feed element contacts and moves with work

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83 99, 83649, B21F 1506

Patent

active

060066393

ABSTRACT:
A solder placement device forms a selected length of a solder wire and delivers it to a pigtailing station where an optical fiber and a crystal diode are to be optically coupled together. The solder placement device includes casing that contains a plunger arranged for reciprocal movement along an axis in the casing. A solder input tube guides solder from a supply spool to a retainer inside the casing. The retainer is mounted to the plunger and arranged to allow unidirectional movement of the wire along the axis such that movement of the plunger toward the output end of the apparatus pulls the solder wire along with the plunger. When the direction of the plunger reverses, the retainer slides along the solder wire, and the apparatus resets to pull in another segment of the solder wire. A cutting mechanism is actuated by movement of the plunger along the axis to cut off a piece of solder of the selected length. An output tube has a first end mounted to the casing adjacent the cutting mechanism. The output tube is arranged to receive the cut off piece of wire so that compressed air blows it to the soldering station.

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patent: 5357072 (1994-10-01), Garwick

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