Solder pastes using alcohol blends as rheological aids

Metal treatment – Compositions

Patent

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148 23, 148 25, B23K 3534

Patent

active

049959212

ABSTRACT:
Solder paste vehicles using blends of monofunctional and polyfunctional alcohols are described. The blend may have a major portion of a low viscosity, monofunctional alcohol solvent and a minor portion of a high viscosity polyfunctional alcohol thickener. The monohydric solvent has a room temperature viscosity of at least 3 centipoise and from about 3 to 18 carbon atoms and may include such materials as 2-butanol, 1-hexanol, 1-heptanol, 1-octanol, 1-nonanol, 1-dodecanol, 2-ethoxyethanol, 2-(2-ethoxyethoxy)ethanol, 2-(2-butoxyethoxy)ethanol, n-hexadecanol, n-octadecanol, benzyl alcohol and mixtures thereof. The polyalcohol has a room temperature viscosity of between about 26 to about 1500 cp and includes compounds such as 1,2-ethanediol; 1,2-propanediol; 1,3-propanediol; 1,2-butanediol; 1,3-butanediol; 1,4-butanediol; 1,2-pentanediol; 1,5-pentanediol; 2,4-pentanediol; 2,5-hexane-diol; glycerol; 1,2,4-butanetriol; 2,2'-(ethylenedioxy)diethanol; 1,12-dodecane-diol; 1,16-hexanedecanediol and mixtures thereof. These blends give improved solubility of organic acid fluxing agents, provide relatively high viscosities of the solder paste and permit lower amounts of solvent to be used.

REFERENCES:
patent: 3436278 (1969-04-01), Poliak
patent: 3734791 (1973-05-01), Poliak
patent: 3796610 (1974-03-01), Sarnacki
patent: 4460414 (1984-07-01), Hwang

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