Solder pastes comprising nonresinous fluxes

Details Solder pastes comprising nonresinous fluxes Solder pastes comprising nonresinous fluxes

2011-04-19

2011-04-19

Stoner, Kiley (Department: 1735)

Metal fusion bonding

Process

Preplacing solid filler

C148S023000, C148S024000, C438S613000

Reexamination Certificate

active

07926700

ABSTRACT:
According to the invention, a resin-free solder paste made from a metal powder, particularly soft solder and a gel, is prepared, wherein the gel according to the invention leaves no residue on the metal surface during the remelting of the metal powder. The gel according to the invention is based on a mixture that is stable during storage and that comprises carboxylic acid(s), amine(s), and solvent(s). Important uses are the application of soft solder pastes on power-modules, die-attach, chip-on-board, SiP (System-in-Package), for wafer-bumping, particularly on UBM's (Under-Bump-Metallization), and SMT (Surface Mounted Technology), particularly coated circuits. With the use of resin-free soft solder pastes according to the invention, cleaning is eliminated before a protective coating process after the soldering of an electrical connection, and the formation of pores in solder bumps deposited on UBM's is reduced to less than 20 vol. %.

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“Gelieren”, http://www.roempp.com/prod/roempp.php.
“Polykondensation”, http://www.roempp.com/prod/roempp.php.

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