Solder paste stencil printer

Details Solder paste stencil printer Solder paste stencil printer

1991-08-12

1992-04-28

Burr, Edgar S.

Printing

Stenciling

1011271, 101126, 101115, 118213, 118406, B41F 1500

Patent

active

051077590

ABSTRACT:
A solder paste stencil printing process and apparatus in which a stencil plate having a porous figure printing area may be used for single component solder paste application. The printing operation is performed by alignment of the stencil pattern figure over the appropriate component substrate pads. With the stencil plate being held in place by downward force, solder paste is dispensed over the stencil plate pattern allowing gravity flow of the paste material into the stencil pattern pores. Excess paste material is squeegeed level to the top surface of the stencil plate and the plate lifted from the substrate surface leaving solder paste in the configured pattern. An associated stencil plate holder matched to the apparatus receiver head allows any number of stencil plate patterns to be made available for solder paste application.

REFERENCES:
patent: 894891 (1908-08-01), Knapp et al.
patent: 4054091 (1977-10-01), Bradley

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