Solder paste inter-layer alignment apparatus for area-array on-b

Details Solder paste inter-layer alignment apparatus for area-array on-b Solder paste inter-layer alignment apparatus for area-array on-b

1995-11-22

1997-12-09

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

228 563, 101127, B23K 3514

Patent

active

056951094

ABSTRACT:
An integrated circuit (IC) package includes solder paste inter-layer and alignment apparatus 100 for applying and aligning solder paste 150 with corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 includes a thin layer 100 which is composed of high-temperature-resistant, non-solder-wetting, and electrical-insulating materials. The apparatus further has a plurality of apertures 110, each disposed on and penetrating through the thin layer 100 for applying solder paste 150 therein and for aligning with the corresponding solder pads 160 on the IC package carrier 200. The apparatus 100 further includes a removable thin film tape 120 disposed on a bottom surface of the thin layer 100 for temporarily maintaining the solder paste 150 in the plurality of apertures 110.

REFERENCES:
patent: 4354629 (1982-10-01), Grassauer et al.
patent: 4842184 (1989-06-01), Miller, Jr.
patent: 5040717 (1991-08-01), McGaffigan
patent: 5323947 (1994-06-01), Juskey et al.
patent: 5324569 (1994-06-01), Nagesh et al.
patent: 5439164 (1995-08-01), Hasegawa et al.
patent: 5456004 (1995-10-01), Swamy
Research Disclosure, "Multilayer Construction Technique for PCB", Kenneth Mason Publications Ltd, England, 33406, Feb. 1992, No. 334.

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