Solder paste for electronic parts

Details Solder paste for electronic parts Solder paste for electronic parts

1987-02-02

1988-04-26

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

75255, B23K 3534, B22F 100

Patent

active

047402520

ABSTRACT:
A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.

REFERENCES:
patent: 4039329 (1977-08-01), Youdelis
patent: 4478638 (1984-10-01), Smith
patent: 4483905 (1984-11-01), Engstrom

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