Metal treatment – Compositions – Fluxing
Reexamination Certificate
2006-05-30
2006-05-30
Jenkins, Daniel (Department: 1742)
Metal treatment
Compositions
Fluxing
Reexamination Certificate
active
07052558
ABSTRACT:
A soldering paste flux for use in soldering copper and copper alloy piping and the like is formed of 40–70% nonylphenol ethoxylate (preferably Tergitol NO-10® made by Dow Chemical), 10–30% glyceryl monostearate, 3–10% acid activator, 3–10% water, and 4–15% mineral salt. The acid activator is preferably a mineral acid and, most preferably, hydrobromic acid. The mineral salt is preferably zinc bromide.
REFERENCES:
patent: 2880126 (1959-03-01), Jordan et al.
patent: 2895862 (1959-07-01), Laudenslager, Jr.
patent: 2978369 (1961-04-01), Battle et al.
patent: 3099590 (1963-07-01), Laudenslager, Jr.
patent: 3220892 (1965-11-01), Durham, Jr.
patent: 3436278 (1969-04-01), Poliak et al.
patent: 3796610 (1974-03-01), Sarnacki et al.
patent: 3902928 (1975-09-01), Yen et al.
patent: 4151015 (1979-04-01), Cooper
patent: 4342607 (1982-08-01), Zado
patent: 4708751 (1987-11-01), Froebel et al.
patent: 4872928 (1989-10-01), Jacobs
patent: 4895606 (1990-01-01), Jafri
patent: 5011546 (1991-04-01), Frazier et al.
patent: 5041169 (1991-08-01), Oddy et al.
patent: 5122201 (1992-06-01), Frazier et al.
patent: 5215602 (1993-06-01), Ali et al.
patent: 5308402 (1994-05-01), Bixenman et al.
patent: 5443660 (1995-08-01), Gao et al.
patent: 5452840 (1995-09-01), Turner
patent: 5571340 (1996-11-01), Schneider et al.
patent: 6474536 (2002-11-01), Kukanskis
patent: 6524398 (2003-02-01), Arora et al.
patent: 2002/0017337 (2002-02-01), Arora et al.
patent: 2243842 (1991-11-01), None
Sabarese Daniel M.
Sabarese Mark A.
Stuhler Harold A.
Chemicals and Metals Technologies, Inc.
Hunt, Jr. Ross F.
Jenkins Daniel
Stites & Harbison PLLC
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