Printing – Stenciling – Traveling-inker machines
Reexamination Certificate
2007-07-31
2007-07-31
Yan, Ren (Department: 2854)
Printing
Stenciling
Traveling-inker machines
C101S129000
Reexamination Certificate
active
10891625
ABSTRACT:
A stencil printer for printing solder paste onto a substrate includes a frame, a stencil, coupled to the frame, having apertures formed therein, a support assembly, coupled to the frame, to support the substrate in a printing position beneath the stencil, and a dispensing head coupled to the frame in such a manner that the dispensing head is configured to traverse the stencil during first and second print strokes. The dispensing head includes a frame assembly and a wiper blade assembly, coupled to the frame assembly, having first and second wiper blades that contact the stencil to print solder paste onto the stencil during a print stroke. The first and second wiper blades are constructed and arranged to force solder paste through the apertures of the stencil. The dispensing head further includes a dispensing unit, coupled to the frame assembly, having a chamber adapted to dispense solder paste, the dispensing unit being disposed between the first and second wiper blades to deposit solder paste therebetween. A method for printing solder paste on a substrate is further disclosed.
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International Search Report for PCT/US2005/025071 mailed Nov. 11, 2005.
Lowrie Lando & Anastasi, LLP
Speedline Technologies, Inc.
Yan Ren
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