Solder paste deposition

Details Solder paste deposition Solder paste deposition

1997-10-20

1998-09-08

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427272, 427282, 427358, 427369, B05D 512

Patent

active

058042482

ABSTRACT:
A multi-layer stencil is disclosed for applying solder paste to a printed circuit board. The stencil is formed from first and second layers of stencil material, e.g., stainless steel sheet, the second layer overlying the first layer in selected areas thereby forming a region of increased stencil thickness in those areas. A first plurality of apertures is defined through the thickness of the first layer only and a second plurality of apertures is defined through the combined thickness of the first and second layers in the selected regions. This type of multilevel stencil is useful for depositing differing thicknesses of solder paste onto a circuit board comprising a hybrid of through-hole and SMT devices.

REFERENCES:
patent: 4176602 (1979-12-01), Fedderson
patent: 4254707 (1981-03-01), Lambert et al.
patent: 4692205 (1987-09-01), Sachdev et al.
patent: 4693209 (1987-09-01), Leicht
patent: 4735694 (1988-04-01), Kukqnskis
patent: 5277749 (1994-01-01), Griffith et al.
patent: 5302219 (1994-04-01), Hargis
patent: 5436028 (1995-07-01), Becher et al.

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