Solder paste and residue measurement system

Electricity: measuring and testing – Impedance – admittance or other quantities representative of... – Lumped type parameters

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324724, G01R 2708

Patent

active

056569335

ABSTRACT:
This invention relates to an on-line statistical process control device for solder paste and residues. The invention consists of electronics hardware, software, and probing systems. The electrical hardware of the invention provides voltage and current measurements of solder paste materials, the software of the invention controls the hardware, provides real-time complex, nonlinear least squares curve fitting for equivalent circuit analysis, data storage and retrieval of circuit parameters and behavior, and statistical process control tracking and charting. The probing systems of the invention allows for 2, 3, and 4 probe surface and bulk measurements of the solder paste and residues.

REFERENCES:
patent: 5234151 (1993-08-01), Spigarelli
patent: 5334261 (1994-08-01), Minahara et al.
patent: 5485392 (1996-01-01), Frederickson et al.
Polcyznski et al; "A New Technique for Monitoring Solder Paste Characterics"; Proc. of the 14th Annual Electronics Manufacturing Seminar, Naval Weapons Center, China Lake, CA; 1990 (month unavailable).
Polcyznski et al; "A New Technique for Monitoring Solder Paste Characteristics"; Surface Mount Tech.; 4; pp. 54-60; Oct. 1990.
Polcyznski et al; "Measuring Solder Paste Metal Content Using Alternating Current Electrical Impedance Techniques"; Proc. 1990 Int. Sym. on Microelectronics, Chicago, Ill.; pp. 174-182; Oct. 15-17, 1990.
Seitz et al; "Thermal Stability of Metal Oxide Surge Suppression Devices"; 1990 EOS/EDS Proceeding, Lake Buena Vista, FL.; Sep. 11-13, 1990; pp. 187-192.
Polcyznski et al; "Microstructural Mechanisms Associated with the Electricial Impendance Characteristics of Solder Paste Flux"; Proc. of the 15th Annual Electronic Manufacturing Seminar; Naval Weapons Center, China Lake, CA; pp. 51-70; 1991 (month unavail.).
Polcyznski et al; "Use of AC Electrical Impedance Techniques for Monitoring Microstructural Changes in Electronic Materials"; Proc. of the 1991 International Sym. on Microelectronics; Orlando, FL.; Oct. 21-23, 1991; pp. 431-435.
Seitz et al; "Monitoring Solder Paste Properties Using Impedance Spectroscopy"; Proc. of the 1992 International Symposium on Microelectronics; San Francisco, CA; Oct. 19-21, 1992; pp. 503-509.
Seitz et al; "Low Frequency Electrical Behavior of Solder Paste"; Proc. of the 16th Annual electronics Manufacturing Seminar; Naval Weapons Center; China Lake, CA; 1993 (month unavailable).
Seitz et al; "AC Electrical Characterization of Solder Paste"; Proc. Electrecon 93; Indianapolis IN; May 19-21, 1993; pp. 14.1-14.18.

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