Solder paste and method of using the same

Details Solder paste and method of using the same Solder paste and method of using the same

1992-11-10

1993-05-18

Rosenberg, Peter D.

Metal treatment

Compositions

Fluxing

148 23, 148 24, B23K 3534

Patent

active

052117642

ABSTRACT:
A solder paste that is useful in applications such as surface mounting of components on printed circuit boards has been found. After soldering, the residue requires no cleaning. The achievement of these desirable properties is accomplished by employing a solder flux vehicle including a three component residue modifier.

REFERENCES:
patent: 3963529 (1976-06-01), Tsunashima
patent: 4495007 (1985-01-01), Fado
Hwang, J. S., Solder Paste in Electronic Packaging, (1989), Van Nostrand, Reinhold, NY., publishers.

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