Metal fusion bonding – Process – Plural diverse bonding
Patent
1995-06-21
1997-05-06
Picardat, Kevin
Metal fusion bonding
Process
Plural diverse bonding
29840, 438118, 156277, H01L 7160
Patent
active
056271085
ABSTRACT:
Glue dots are deposited on a substrate side of a partially completed printed circuit board, between pairs of component mounting pads disposed on the substrate and having quantities of solder paste thereon, using a resilient stencil plate having a spaced series of glue discharge openings extending transversely therethrough, and a spaced series of side recesses. The recess side of stencil plate is positioned in a spaced, parallel and opposing relationship with the mounting pad side of the substrate with the plate recesses being aligned with the substrate mounting pads, and the glue discharge openings being aligned with glue leveling pads disposed on the substrate side between adjacent mounting pad pairs. Glue is deposited on the outer stencil plate side and a squeegee blade is moved along the outer stencil plate side to deflect it toward the substrate and force glue through the discharge openings to deposit glue dots thereon when the stencil plate is permitted to return to its undeflected position. As the plate is deflected, its depressions receive and provide clearance for the mounting pads so as not to disturb the solder paste quantities thereon. Electrical components are then pressed against pairs of mounting pads, and the glue dots therebetween, before being subjected to a final soldering process. In this manner the use of a needle type dispensing machine to deposit the glue dots is advantageously avoided.
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Alibocus Andrew A.
Beacleay Troy W.
Haarde John F.
Hua John
Smith Mark A.
Compaq Computer Corporation
Picardat Kevin
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