Solder paste and conductive ink printing stencil cleaner

Brushing – scrubbing – and general cleaning – Machines – With air blast or suction

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A47L 538

Patent

active

054918715

ABSTRACT:
A solder paste or conductive ink printer stencil wiper apparatus combining a dual action of sucking stencil holes and simultaneously wiping the bottom of the stencil for excess solder. The apparatus includes a vacuum nozzle constructed and arranged to draw excess solder gathered in the holes of the stencil through the nozzle to a collection reservoir. The apparatus also includes a wiping element for wiping the bottom of the stencil at the same time the vacuum is sucking solder out of the stencil holes. The wiper includes a wiper fabric to wipe the bottom of the stencil. The fabric is provided on a roll, and the fabric is pulled through a series of rollers by a motor and collected on a take-up roller.

REFERENCES:
patent: 3737940 (1973-06-01), Moestue et al.
patent: 4145790 (1979-03-01), Wessells et al.
patent: 4543684 (1985-10-01), Bandoh et al.
patent: 5197159 (1993-03-01), Truong
patent: 5206970 (1993-05-01), Johnson
patent: 5309837 (1994-05-01), Nanzai

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