Solder paste

Details Solder paste Solder paste

2005-08-09

2005-08-09

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Free metal containing

C148S024000, C420S557000, C420S562000

Reexamination Certificate

active

06926849

ABSTRACT:
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01-10.0 wt % of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.

REFERENCES:
patent: 1348513 (2003-10-01), None
patent: 6015483 (1994-01-01), None
patent: 8155676 (1996-06-01), None
patent: 3105505 (2000-11-01), None
patent: 2002-045993 (2002-02-01), None

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