Solder paste

Details Solder paste Solder paste

1991-06-28

1992-09-29

Heinrich, Samuel M.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

228248, 148 24, 148 25, B23K 3526, B23K 35363

Patent

active

051508320

ABSTRACT:
A solder flux that is useful in applications such as surface mounting of components on printed circuit boards has been found. After soldering, the residue from the flux is either removable by water cleaning or requires no cleaning at all. The achievement of these desirable properties is accomplished by employing a solder flux vehicle including a removing agent, a low vapor pressure component, a high temperature component, and a rheological properties promoter.

REFERENCES:
patent: 4487638 (1984-12-01), Hoge
patent: 4759490 (1988-07-01), Ochiai
patent: 4960236 (1990-10-01), Hedges et al.
patent: 5064482 (1991-11-01), Goobich et al.
Solder Paste in Electronic Packaging, J. S. Hwang, VanNostrand, Reinhold, NY (1989), table of contents only.
IPC Technical Paper, TP-901, J. R. Morris et al, "Characterizing Solder Pastes for the 1990s", Institute for Interconnection and Packaging of Electronic Circuits, Lincolnwood, Ill., Sep. 1990.
IPC-SP-819, "General Requirements and Test Methods for Electronic Grade Solder Paste", Institute for Interconnection and Packaging of Electronic Circuits, Lincolnwood, Ill., Oct. 1988.

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