Solder paste

Details Solder paste Solder paste

1994-12-19

1996-11-12

Andrews, Melvyn

Metal treatment

Compositions

Fluxing

2282481, 428570, B23K 3534

Patent

active

055736025

ABSTRACT:
A solder paste is made from solder powder having two different alloys. The individual particles in the solder powder consist of a low melting solder coating (115) that surrounds a nucleus (120) of a higher melting solder. The low melting solder is compositionally distinct from the higher melting solder. The particles are suspended in a matrix of a solder paste vehicle, which may also contain a fluxing agent. In one embodiment of the invention, the low melting solder is an alloy of 43% tin, 43% lead and 14% bismuth, and the higher melting solder is an alloy of 52% tin, and 48% bismuth.

REFERENCES:
patent: 4097266 (1978-06-01), Takshashi et al.
patent: 4731130 (1988-03-01), O'Leary
patent: 5086966 (1992-02-01), Melton et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5229070 (1993-07-01), Melton et al.
patent: 5233504 (1993-08-01), Melton et al.
patent: 5328521 (1994-07-01), Kevsseyan
patent: 5382300 (1995-01-01), Blonder
patent: 5389160 (1995-02-01), Melton et al.
patent: 5427865 (1995-06-01), Mullen, III

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