Solder paste

Details Solder paste Solder paste

1999-03-02

2000-12-12

King, Roy V.

Metal treatment

Compositions

Fluxing

148 24, B23K 3534

Patent

active

061593044

ABSTRACT:
In order to prevent aging of an Sn--Zn system alloy solder paste, 0.5-5% by weight of a compound obtained by adding an ethylene oxide to cyclohexylamine, preferably together with 0.5-5% by weight of a polyoxyethylene alkylamine is added to a flux of said solder paste.

REFERENCES:
patent: 4077815 (1978-03-01), Schuessler
patent: 4460414 (1984-07-01), Hwang
patent: 5296046 (1994-03-01), Juskey et al.
Asano, Shozo. "Water Soluble Cream Solder" Japanese Patent Abstract JP 4-4313487 A, Nov. 1992.
The American Heritage Dictionary of the English Language, Third Edition 1992.
Derwent Abstract #419088 "Water-Soluble Solder Cream for PCB(s)" for JP 04313487 Nov. 5, 1992.
Lewis, Richard J., "Condensed Chemical Dictionary," 12th edition. 1993. P. 1012.

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