Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-08-09
2005-08-09
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S772000, C257S779000
Reexamination Certificate
active
06927492
ABSTRACT:
A device including a first solder pad and a second solder pad comprised of a post-soldering alloy composition on a substrate is provided. The alloy composition comprises two or more elements, and the post soldering alloy composition of the first solder pad has different amounts of the two or more elements than the alloy composition of the second solder pad. A method of making a solder pad comprises masking a substrate comprising at least a first solder pad and a second solder pad, wherein the mask exposes a greater area of the first solder pad so that the deposited element becomes part of an alloy composition of the first solder pad upon soldering thereby changing the melting point of the first solder pad.
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Baskin Jonathan D.
Ho Tu-Tu
Nelms David
Shipley Company L.L.C.
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