Solder pad configuration for wave soldering

Details Solder pad configuration for wave soldering Solder pad configuration for wave soldering

1993-02-10

1994-05-03

Heinrich, Samuel M.

Metal fusion bonding

Solder form

361736, H05K 100

Patent

active

053079809

ABSTRACT:
A printed circuit board is provided with a solder pad configuration for wave soldering a surface mount device with its longitudinal axis in a direction perpendicular to the solder wave. A leading solder pad is not wider than the surface mount device. A trailing solder pad is wider than the surface mount device, thereby ensuring that the trailing pad is sufficiently wet by the solder wave.

REFERENCES:
patent: 4034467 (1977-07-01), Sapunarow et al.
patent: 4164778 (1979-08-01), Sawairi et al.
patent: 4339784 (1982-07-01), Shearer
patent: 4637541 (1987-01-01), Tanny
patent: 4645114 (1987-02-01), Van Den Brekel et al.
patent: 4772762 (1988-09-01), Fukino
patent: 4851966 (1989-07-01), Roback et al.
patent: 4870225 (1989-09-01), Anao et al.
patent: 4874907 (1989-10-01), Ishikawa et al.
patent: 4916807 (1990-04-01), Wiese
patent: 5144535 (1992-09-01), Megens et al.
patent: 5155904 (1992-10-01), Majd

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