Solder pad/circuit trace interface and a method for generating t

Details Solder pad/circuit trace interface and a method for generating t Solder pad/circuit trace interface and a method for generating t

1989-12-27

1991-06-18

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 351, 204 40, 427 96, C25D 502, C25D 548, C25D 510, B05D 512

Patent

active

050247344

ABSTRACT:
A circuit trace/solder pad interface for closely spaced circuit traces is presented in which solder must be deposited to form a solder pad upon the circuit trace and the solder not migrate onto the circuit trace upon solder reflow. Through the intentional selection of solderably incompatible metals for the circuit trace and the solder pad, the solder pad may be isolated from the circuit trace thereby retaining solder on the pad. Furthermore a method for fabricating this circuit trace/solder pad interface is presented.

REFERENCES:
patent: 3778530 (1973-12-01), Reimann
patent: 4104111 (1978-08-01), Mack
Duffek, E., "PC Processing Using Solder Mask Over Tin-Nickel", Electronic Packaging and Production, Jun. 1979, pp. 71-73.

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