Solder or brazing barrier

Details Solder or brazing barrier Solder or brazing barrier

1989-01-27

1991-09-24

James, Andrew J.

H01L 2350, H01L 2334

Patent

active

050518119

ABSTRACT:
A method of preparing a substrate such as a semiconductor chip or ceramic thin film having vias for soldering to a substrate requires that a first metal that is resistive to solder bonding be deposited on the backside of the semiconductor device. The deposited metal is removed from the surface of the semiconductor device, leaving the vias of the semiconductor device having the first metal deposited through them. This technique is useful in any requirement requiring a solder or brazing barrier. This is, a photolithographic process in conjunction with a refractory or nonsolderable metal deposit is used to achieve an alloy or solder barrier.

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