Solder nozzle with gas knife jet

Details Solder nozzle with gas knife jet Solder nozzle with gas knife jet

1990-07-09

1993-07-20

Seidel, Richard K.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228219, B23K 100, B23K 300

Patent

active

052286142

ABSTRACT:
A solder nozzle to produce a smooth turbulent free solder wave has at least one air jet associated therewith to remove solder icicles and bridges that can form on the under surface of circuit boards and other elements. The circuit boards move in an upward inclined path in the direction of travel and after passing through the solder wave an air knife projects a non-oxidizing gas with sufficient force to remove excess solder. The soldering can occur in a non-oxidizing gas enclosure such as an inert gas, or a reducing gas, and vibrating the solder wave below ultrasonic frequencies can assist in the soldering.

REFERENCES:
patent: 3500536 (1970-03-01), Goldschmid
patent: 3705457 (1972-12-01), Tardoskegyi
patent: 3765591 (1973-10-01), Cook
patent: 3865298 (1975-02-01), Allen et al.
patent: 3921888 (1975-11-01), Elliott et al.
patent: 4083323 (1978-04-01), Rote
patent: 4401253 (1983-08-01), O'Rourke
patent: 4410126 (1983-10-01), O'Rourke
patent: 4465014 (1984-08-01), Bajka
patent: 4664308 (1987-05-01), Boynton
patent: 4684056 (1987-08-01), Deambrosio
patent: 5044542 (1991-09-01), Deambrosio
EXXAIR Knife--Published by EXXAIR Corp.--date unknown.
Atmosphere Control in Continuous Furnaces for Electronic Applications--Nowotarski & Schmidt, ISHM Conference, Anahein, Calif., Published Nov. 11, 1985.

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