Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Patent
1987-09-28
1988-08-30
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
29843, 2281801, H01R 2372
Patent
active
047673443
ABSTRACT:
An electrical component having an elongated contact element provided with a premeasured bead of solder thereon such that, in reflow operation, it can be joined to a contact on another component. In one embodiment, the solder bead can be formed on the pins of a component adapted for mounting on a printed circuit board. In another embodiment, the solder bead is formed on a finger contact of a plug connector adapted to engage a surface contact on an associated daughter board. For both embodiments, the bead is formed by using a mold which assures that each bead contains a uniform amount of solder. The construction enables mixed technology to be mounted on a printed circuit board with both pin mounted components and surface mounted components to be mounted simultaneously in a reflow operation. The entire process resulting in the novel electrical component and in a device incorporating the novel electrical component is also disclosed.
REFERENCES:
patent: 3324230 (1967-06-01), Sherlock
patent: 3780433 (1973-12-01), Lynch
patent: 3915546 (1975-10-01), Cobaugh et al.
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patent: 4505035 (1985-03-01), Burton
patent: 4631639 (1986-12-01), Biraud
patent: 4663815 (1987-05-01), Hartman et al.
Electronics, Sized Solder Bumps Make Solid Joints, vol. 54, No. 22, p. 46, 11-3-1981.
International Technology Disclosures, vol. 3, No. 9, Document 98502, 9-1985.
One page advertisement, connections mfd. by TEKA Prod., Inc., new product announcement , EE Magazine, p. 30, 7-1986.
Abrams Neil
Burndy Corporation
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