1981-03-30
1984-02-28
James, Andrew J.
357 68, H01L 2348, H01L 2944, H01L 2952, H01L 2962
Patent
active
044344341
ABSTRACT:
A controlled geometric configuration of contact pads for securing solder mounds to an integrated circuit chip which reduces cracking of brittle passivating coatings in fabrication of components.
REFERENCES:
patent: 3461357 (1969-08-01), Mutter et al.
patent: 3906541 (1975-09-01), Goronkin
patent: 4258382 (1981-03-01), Harris
patent: 4290079 (1981-09-01), Carpenter et al.
IBM-TDB, "Fabricating Ohmic Contacts", V. 9, No. 4, Sep. 1966, pp. 430-431, R. M. Chapman.
Bhattacharya Somnath
Hu Shih-Ming
Koopman Nicholas G.
Oldakowski Chester C.
International Business Machines - Corporation
James Andrew J.
Nehrbass Seth M.
Powers Henry
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