Solder, microelectromechanical component and device, and a...

Details Solder, microelectromechanical component and device, and a... Solder, microelectromechanical component and device, and a...

2008-07-22

2008-07-22

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23028, C257SE23082

Reexamination Certificate

active

07402910

ABSTRACT:
A solder, in particular a thin-film solder, for joining microelectromechanical components, wherein the solder is a eutectic mixture of gold and bismuth. Components and devices joined by a solder of this type are also disclosed, in addition to processes for producing such components or devices.

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Hansen, Max, Ph.D.Constitution of Binary Alloys. New York: McGraw-Hill, 1958, pp. 188-189.

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