Solder method

Details Solder method Solder method

1997-03-05

1998-06-02

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming multiple superposed electrolytic coatings

205225, 205226, 228208, 228209, C25D 510, C25D 550, B23K 120

Patent

active

057593795

ABSTRACT:
A soldering method for soldering electronic components onto a copper (Cu) substrate using a tin (Sn) solder alloy. The method comprises in pretreating the Cu substrate by depositing a thin layer of zinc (Zn) before the deposition of the Sn solder alloy. This method greatly enhances the mechanical and electrical properties of the solder alloy, allowing the use of lead (Pb) free alloys such as tin-bismuth (Sn--Bi).

REFERENCES:
patent: 4923575 (1990-05-01), Voss et al.
patent: 5393489 (1995-02-01), Gonya et al.

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