Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Patent
1994-06-08
1996-04-23
Ramsey, Kenneth J.
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
228 563, 22818022, H01R 909
Patent
active
055098150
ABSTRACT:
Electronic devices having at least two components wire mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two component. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to the diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.
REFERENCES:
patent: 4003621 (1977-01-01), Lamp
patent: 4644101 (1987-02-01), Jin et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4737112 (1988-04-01), Jin et al.
patent: 4820376 (1989-04-01), Lambert et al.
patent: 4949455 (1990-08-01), Nakamura et al.
patent: 5045249 (1991-09-01), Jin et al.
S. Jin et al., "New, Z-Direction Anisotropically Conductive Composites," Journal of Applied Physics, vol. 64, No. 10, Part II, 15 Nov. 1988, pp. 6008-6010. Cited in application; technological background of the invention.
S. Jin et al., "Anisotropically Conductive Polymer Films With A Uniform Dispersion of Particles," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 16, No. 8, Dec. 1993, pp. 972-977. Technological background of the invention.
Jin Sung-ho
McCormack Mark T.
Alber Oleg E.
AT&T Corp.
Chin Dexter K.
Ramsey Kenneth J.
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