Solder material and electronic part using the same

Details Solder material and electronic part using the same Solder material and electronic part using the same

1998-05-12

2000-12-12

Sough, Hyung-Sub

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

148400, 420558, 420566, H05K 109

Patent

active

061602248

ABSTRACT:
An object of this invention is to provide a solder material capable of, when joining an electronic component to a substrate with the solder material, improving heat fatigue resistance thereof and reducing damage of Ni film interposed therebetween. A solution of this invention is to assemble an electronic part by soldering a semiconductor device with a substrate using solder balls made of a solder material containing from 0.01 to 4.99% by weight of Fe; from 0.01 to 4.99% by weight of Ni, total thereof being from 0.02 to 5.0% by weight; from 0.1 to 8.0% by weight of at least one of Ag and In; from 0 to 70% by weight of Pb, balance containing Sn and unavoidable impurity.

REFERENCES:
patent: 4416853 (1983-11-01), Morikawa et al.
ASTM vol. 02.04; 1987, pp. x-xiv, 21-31, 192-198, 917-921.
The Encyclopedia of Chemistry, Supplement, George L. Clark-Editor-in-Chief, Reinhold Publishing Corporation, 1958, p. 310.
McGraw-Hill Dictionary of Scientific and Technical Terms, Second Edition, Daniel N. Lapedes, Editor-in-Chief, 1978, p. 208.
Constitution of Binary Alloys, Second Edition, Dr. Max Hansen, McGraw-Hill Book Company, 1958, pp. x-xiv, 18, 610, 634, 1107.

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