Solder mask for a finger connector on a single in-line package m

Details Solder mask for a finger connector on a single in-line package m Solder mask for a finger connector on a single in-line package m

1995-04-11

1997-07-01

Thomas, Laura

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 2281791, 29840, H05K 102

Patent

active

056444753

ABSTRACT:
A solder resist pattern for a single in-line package (SIP) finger connector, or other interface member includes small solder resist features spaced closely together. The features can be circular, square, diamond-shaped, star-shaped, or other geometry and preferably are placed on finger connectors in a photo-imaging process. The pattern includes meniscus channels which are narrow enough to prevent solder from adhering to the finger connectors. The surface area of the features is small enough so that the pattern can be easily removed by a low impact or non-contact operation. Preferably, the pattern is removed by a hot air solder knife after the board is subjected to a solder wave.

REFERENCES:
patent: 3610811 (1971-10-01), O'Keefe
patent: 3851223 (1974-11-01), Yonezuka et al.
patent: 3993936 (1976-11-01), Meade et al.
patent: 4767892 (1988-08-01), Koban
patent: 5031072 (1991-07-01), Malhi et al.
patent: 5329068 (1994-07-01), Hirata et al.
patent: 5343366 (1994-08-01), Cipolla et al.
patent: 5373113 (1994-12-01), Ishii
patent: 5478973 (1995-12-01), Yoon et al.

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