Solder mask configuration for a printed circuit board of a...

Electrical connectors – With insulation other than conductor sheath – Plural-contact coupling part

Reexamination Certificate

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Details

C439S083000, C439S076100

Reexamination Certificate

active

06623306

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a solder mask configuration for a printed circuit board, and particularly to a solder mask configuration for a printed circuit board of a modular jack which improves breakdown voltage performance.
2. Description of Prior Art
During the manufacture of a printed circuit board, a solder mask, which remains on the printed circuit board when in use, is generally used to protect the circuitry and to provide insulation.
FIGS. 4 and 5
show a printed circuit board
53
employed in a modular jack (not shown) and engaging with a first terminal insert
51
and a second terminal insert
52
, respectively. The printed circuit board
53
has no solder mask thereon and only a conductive metal layer
533
coated on an inside surface of each terminal insertion hole
531
for electrically connecting with a press-fitted end
512
of a first terminal
511
of the first terminal insert
51
or a press-fitted end
522
of a second terminal
521
of the second terminal insert
52
. The conductive metal layer
533
forms a base ring
535
on the printed circuit board
53
, which is delimited by an outer perimeter
534
thereof. However, a relatively small increase in voltage using this printed circuit board configuration may result in arcing between adjacent base rings
535
, because of a relatively short creepage distance L′.
Hence, a printed circuit board having an improved breakdown voltage performance for use in a modular jack, is required.
BRIEF SUMMARY OF THE INVENTION
The object of the present invention is to provide a printed circuit board which has an improved breakdown voltage performance for use in a modular jack.
In order to achieve the above-mentioned object, a printed circuit board in accordance with the present invention includes a plurality of terminal insertion holes defined therethrough. A conductive layer is coated on an inner surface of each terminal insertion hole. A solder mask covers portions of a front and rear surfaces of the printed circuit board between adjacent terminal insertion holes. The mask extends a distance into each terminal insertion hole. As a result, a creepage distance between adjacent holes is increased compared with that of the prior art.
A modular jack using such a printed circuit board comprises an insulating housing, with a first terminal insert and a second terminal insert assembled to the printed circuit board, the assembly of the board with first and second terminal insert being received in the insulating housing. A metal shield encloses the insulating housing. The printed circuit board further has a noise filter soldered thereon for EMI purpose. The first terminal insert comprises an insulative base with a plurality of terminals embedded therein and the second terminal insert comprises an insulative body with a plurality of conductive pins embedded therein. Each terminal and each conductive pin has a press-fitted end for being inserted into and electrically engaging with the corresponding terminal insertion hole.


REFERENCES:
patent: 6010367 (2000-01-01), Wu
patent: 6171152 (2001-01-01), Kunz
patent: 6174198 (2001-01-01), Wu et al.
patent: 6179668 (2001-01-01), Kan

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