Solder mask composition

Details Solder mask composition Solder mask composition

1979-01-31

1980-12-23

Griffin, Ronald W.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 22CQ, 427154, 427155, 427156, 428901, C09D 352, C09D 366

Patent

active

042409454

ABSTRACT:
There is disclosed a composition useful as a solder mask coating for use in the manufacture of printed circuit boards and the like which comprises a mixture of an alkyd resin and an alkylated amino resin, a minor quantity of a hydrocarbon resin, an inorganic filler derived from sedimentary shale of a particular origin, and sufficient organic solvent to provide a working viscosity suitable for silk-screening applications. The invention comprises also the use of a preferred and particular inorganic filler known as Panamint Earth.

REFERENCES:
patent: 3365321 (1968-01-01), Adler
patent: 3874949 (1975-04-01), Kaneda et al.
patent: 4025474 (1977-05-01), Porter et al.
patent: 4038225 (1977-07-01), Takaya et al.
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4119596 (1978-10-01), Okuda et al.

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