Solder mask and structure of a substrate

Details Solder mask and structure of a substrate Solder mask and structure of a substrate

2005-11-01

2005-11-01

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S632000, C257S637000, C257S774000

Reexamination Certificate

active

06960822

ABSTRACT:
A substrate includes a dielectric structure, an interconnection structure and a solder mask. The interconnection structure interlaces inside the dielectric structure. The solder mask covers the dielectric structure. The material of the solder mask can be the same as that of the dielectric structure contacting the solder mask. The material of the solder mask can be epoxy resin or bismaleimide-triazine.

REFERENCES:
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5665526 (1997-09-01), Markovich et al.
patent: 2003/0184979 (2003-10-01), Tsai et al.
patent: 2004/0080027 (2004-04-01), Grigg et al.

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