Metal fusion bonding – Including means to apply flux or filler to work or applicator – By partial or total immersion of work or applicator into liquid
Patent
1988-11-09
1989-09-26
Ramsey, Kenneth J.
Metal fusion bonding
Including means to apply flux or filler to work or applicator
By partial or total immersion of work or applicator into liquid
228 40, 118423, B23K 306
Patent
active
048694185
ABSTRACT:
A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated. The rack is then withdrawn from the molten solder and is pivoted upwardly while positioned over the molten solder. Simultaneously, an anvil is rotated from a home position to an impact position at precisely the correct moment. With the solder still molten on the substrate surfaces, the rack is then permitted to descend and is positively biased to strike the anvil thereby dislodging any excess molten solder. A unique supporting arrangement for the rack insures that only a minimum of mass acutally impacts against the anvil while insuring the effectiveness of the operation. Each cantilevered arm from which a rack is suspended is temporarily supported during the impacting operation after which the support member is withdrawn. Also, a solder pot of unique design and operation is provided to assure rapid, complete heating of substrates while eliminating contamination thereof by dross and oxides.
REFERENCES:
patent: 1716671 (1929-06-01), Taylor
patent: 1739482 (1929-12-01), Griswald
patent: 2267273 (1941-12-01), Garbe
patent: 2723922 (1955-11-01), Fleming
patent: 2723922 (1955-11-01), Bajka et al.
patent: 2821159 (1958-01-01), Rayburn et al.
patent: 2986114 (1961-05-01), Fuchs et al.
patent: 3058441 (1962-10-01), Walker et al.
patent: 4072777 (1978-02-01), Schoenthaler
Emerick Alan J.
Larnerd James M.
Newman Gary L.
Simpson John P.
International Business Machines - Corporation
Ramsey Kenneth J.
LandOfFree
Solder leveling method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Solder leveling method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder leveling method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-183002