Solder leveling device having means for vertically guiding print

Coating apparatus – With heat exchange – drying – or non-coating gas or vapor... – To remove or spread applied coating by gas blast

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Details

118423, 118428, 228 20, H05K 324

Patent

active

044149140

ABSTRACT:
A printed circuit board solder leveling device comprising guides distributed across the width of the soldering bath container. Each guide comprises opposed guide rods spaced apart a distance greater than the thickness of a printed circuit board so that there is loose contact only of the guides with opposite sides of the board.

REFERENCES:
patent: 1479783 (1924-01-01), Bentley
patent: 2999302 (1961-09-01), Beukema
patent: 3532262 (1980-10-01), Laubmeyer
patent: 3606132 (1971-09-01), Rinaldi
patent: 3825164 (1974-07-01), Sarnaki et al.
patent: 3865298 (1975-02-01), Allen et al.
patent: 4083323 (1978-04-01), Rote
patent: 4333417 (1982-06-01), Camp et al.

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