Solder leveling apparatus and method

Details Solder leveling apparatus and method Solder leveling apparatus and method

1995-07-25

1997-04-08

Heinrich, Samuel M.

Metal fusion bonding

Process

With removing or reshaping of filler material or flash after...

228 201, 228254, 118106, 427349, H05K 334, B23K 308, B23K 100

Patent

active

056179898

ABSTRACT:
Embodiments of a new apparatus for leveling solder contacts on printed circuit board panels are disclosed. A fluid is received by a platen and dispersed against a belt that engages the panel. A surface of the platen causes the pressure of the fluid to automatically adjust to the area of the panel by providing a series of parallel channels or holes in the surface.

REFERENCES:
patent: 3973893 (1976-08-01), Camp, III
patent: 3992135 (1976-11-01), Camp, III
patent: 4025272 (1977-05-01), Camp, III
patent: 4752027 (1988-06-01), Gschwend
patent: 5167361 (1992-12-01), Liebman et al.
patent: 5172853 (1992-12-01), Maiwald
patent: 5226964 (1993-07-01), Meuche
patent: 5480483 (1996-01-01), Velie

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