Solder leveler

Details Solder leveler Solder leveler

1982-09-13

1986-10-28

Kittle, John E.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118 56, 118 58, 228 20, 228 40, 427273, B23K 108, B05D 512

Patent

active

046198415

ABSTRACT:
Printed circuit boards that may contain through-holes, conductors, connectors, etc. are soldered by covering such boards with liquid solder. During such a process, excess or undesirable solder is typically residual on the surface of such boards, and, more specifically, within the through-holes. By the present system, the printed circuit boards are placed in contact with liquid flux, then with liquid solder and are then removed from contact with the liquid solder and passed between two heat transfer medium spray elements which are fully immersed within the heat transfer medium. Said spray elements direct generally opposing laminar flows, enhanced by a Venturi effect, onto such board thereby sweeping off the undesired solder, clearing the holes, and leaving an optimum thickness solder layer where appropriate. The excess solder removed is collected within the system reservoir to be returned to the solder tank for reuse. A final rinse is provided to remove heat transfer medium from the printed circuit board.

REFERENCES:
patent: 2671264 (1954-03-01), Pessel
patent: 3795358 (1974-03-01), Sarnacki
patent: 3865298 (1975-02-01), Allen

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