Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate
2007-11-13
2007-11-13
Tran, Len (Department: 1725)
Metal fusion bonding
Process
Preplacing solid filler
C228S233200, C228S043000
Reexamination Certificate
active
10865474
ABSTRACT:
A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.
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European Search Report corresponding to Application No. PCT/JP03/169077 dated Feb. 22, 2006.
Akamatsu Hiroshi
Asai Kenji
Hibino Minoru
Iwasaki Shigeru
Kai Hiroshi
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