Solder jet printhead

Details Solder jet printhead Solder jet printhead

1996-06-07

1998-07-14

Kastler, Scott

Metallurgical apparatus

Means for melting or vaporizing metal or treating liquefied...

With means to discharge molten material

222595, 427422, B05D 102

Patent

active

057799717

ABSTRACT:
A solder drop ejector is disclosed where a current through liquid solder in a channel flows in a direction opposite to the direction of current through a fixed conductor insulated from the channel. The magnetic fields generated repulse the solder toward an orifice to eject a droplet of solder. The dielectric layer separating the fixed conductor and the solder is formed of a film. The film may be made extremely thin, such as 0.1 microns, so that the necessary repulsion force generated by the oppositely flowing currents may be achieved with relatively low driving currents of 10-200 amperes. The thin dielectric film is not molded and is not required to provide mechanical support to a channel wall. Hence, the manufacturing of the resulting solder jet printhead is simplified and its reliability is improved.

REFERENCES:
patent: 4828886 (1989-05-01), Heiber
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5377961 (1995-01-01), Smith et al.

Affiliated with

Also associated with

Rating

Solder jet printhead does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder jet printhead, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder jet printhead will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1878940